Dell AW2721DB User manual

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1. Disassembly Procedures

S1 Turn off power

S2 Place the monitor on a soft cloth or

cushion

Carefully slide and remove the I/O

cover from the monitor.

S3 Disconnect the cables from the monitor

and slide them out through the cable-

management slot on the stand riser.

S4 Press and hold the stand release button

S5 Lift the stand up and away from the

monitor.

S6 Unlock 4 screws on rear cover

Use hands or scraper bar to

disassemble Rear Cover from the

monitor.

Notice the disassembly order:

Left Side=> Top Side=>Right

Side=>Bottom Side

(Screw Torque: 8-10 kgf)

S7 Remove USB FFC and Audio FFC from

I/F BD

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S8 Remove 1 tape on LED Driver BD wire

from Main SHD and disconnect LED

Driver BD wire from I/F BD

Disconnect CTRL FFC cable from I/F

BD and tear it from Main SHD

Take off Rear Cover

S9 Remove all tapes from cables and Rear

Cover

S10

Remove all cables from LED Driver BD

Unlock 1 screw and disassemble LED

Driver BD from Rear Cover

(Screw Torque: 4.5±0.5 kgf)

S11

Tear off “MYLAR HEAD LOGO” from

cover LOGO LENS

Disconnect LED wire from LED BD

Disassemble LED BD from Rear Cover

S12

Remove 2 tapes on Jack BD from Rear

Cover

Tear off RC Mylar from USB BD and

Jack BD

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S13

Disassemble Jack BD from Rear Cover

Remove 2 wires from Jack BD

Unlock 2 screws to disassemble USB

BD from Rear Cover

(Screw Torque: 4.5±0.5 kgf)

S14

Disconnect USB FFC and Audio FFC

from USB BD

S15

Remove FFC cable from Rear Cover,

CTRL BD and CTRL+KEY BD

Unlock 6 screws to disassemble CTRL

BD and CTRL+KEY BD from Rear

Cover

(Screw Torque

2.0±0.5

)

S16

Take off 1 gasket from Middle Frame

S17

Remove all tapes from Main SHD and

Middle Frame

S18

Disconnect Backlight Wires from Panel

and SPS+LED BD

S19

Disconnect Sensor BD FFC from I/F BD

and tear off it from panel and Main SHD

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S20

Disconnect Light Sensor BD FFC from

I/F BD and tear off it from Panel and

Main SHD

S21

Disconnect “CTRL+LENS BD FFC”

from I/F BD and tear off it from Panel

and Main SHD

S22

Unlock MF screws*7 and inferior

screws*5 to disassemble Middle Frame

from Panel

(Screw Torque: 4.5±0.5 kgf)

S23

Tear off a yellow tape and an acetate

tape from EDP cable and panel

Disconnect EDP cable from Panel

Take off Main SHD from Panel.

S24

Disassemble Light Sensor BD from

Middle Frame

S25

Unlock 2 screws to disassemble Power

Button module from Middle Frame

(Screw Torque: 1.1±0.1 kgf)

S26

Disconnect FFC cable from

“CTRL+LENS BD” (Power CTRL BD)

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S27

Tear off “MYLAR PWR-LENS“ from

“CTRL+LENS BD” (Power CTRL BD)

S28

Unlock 2 screws to disassemble

“CTRL+LENS BD” (Power CTRL BD)

from Power Button

(Screw Torque: 2±0.5 kgf)

S29

Disassemble Sensor BD from Middle

frame

S30

Unlock 1 screw to disassemble Docking

BD from Main SHD

Disassemble wire from Docking BD

(Screw Torque: 8.5±1.0 kgf)

S31

Disassemble mylar from Main SHD

S32

Tear off an adhesive tape and a yellow

tape from I/F BD and EDP cable

Disconnect EDP cable from I/F BD

S33

Unlock 11 screws on PCBA to

disassemble SPS+LED BD, SPS BD

and I/F BD from Main SHD

(Screw Torque: 8.5±1.0 kgf)

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S34

Disconnect wires from I/F BD, SPS BD

and SPS+LED BD

S35

Unlock 1 ground screw to disassemble

AC Socket from Main SHD

(Screw Torque: 8-10 kgf)

S36

Disconnect Fan Cable from I/F BD

S37

Unlock 4 screws to disassemble G-

SYNC Module from I/F BD

(Screw Torque: 4-4.5 kgf)

S38

Unlock 4 Heat Sink screws and 4

captive screws to disassemble G-Sync

module, Heat Sink Module and SHEET

STIFFENER

Tear off MYLAR from SHEET

STIFFENER

(Screw Torque-Heat Sink: 2-2.5 kgf)

(Screw Torque-Captive screw: 4-4.5

kgf)

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S39

Remove electrolyte capacitors (red mark) from printed circuit boards

S39-1 Cut the glue between bulk cap. and PCB with a knife

S39-2 Ensure cutting path within the glue, don’t touch bulk cap. or PCB

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S39-3 Take out bulk cap. pin solder with soldering iron and absorber

S39-4 Lift the bulk cap. up and away from the PCB

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2. Product material information

The following substances, preparations, or components should be disposed of or

recovered separately from other WEEE in compliance with Article 4 of EU Council

Directive 75/442/EEC.

Capacitors / condensers (containing

PCB/PCT)

No used

Mercury containing components

No used

Batteries

No used

Printed circuit boards (with a surface greater

than 10 square cm)

Product has printed circuit boards

(with a surface greater than 10 square

cm)

Component contain toner, ink and liquids

No used

Plastic containing BFR

No used

Component and waste contain asbestos

No used

CRT

No used

Component contain CFC, HCFC, HFC and

No used

Gas discharge lamps

No used

LCD display > 100 cm2 Product has an LCD greater than 100

cm2

External electric cable

Product has external cables

Component contain refractory ceramic fibers

No used

Component contain radio

active substances

No used

Electrolyte capacitors (height

> 25mm, diameter > 25mm)

Product has electrolyte capacitors

(height >25mm, diameter > 25mm)

3. Tools Required

List the type and size of the tools that would typically can be used to disassemble the

product to a point where components and materials requiring selective treatment can be

removed.

Tool Description:

- Screwdriver

- Scraper Bar

- Penknife

- Soldering iron and absorber

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