Daewoo 710C User manual
Service Manual
XGA COLOR MONITOR
Model : 710C
DAEWOO ELECTRONICS CO., LTD
OVERSEAS SERVICE DEPT.
4
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive (ES) Devices.
The examples of typical ES devices are integrated circuits, some field-effect transistors and semiconductor “chip”
components. The following techniques should be used to help reduce the incidence of component damage
caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface
such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as “anti-static”
can generate enough electrical charges to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate enough electrical charges to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to
install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive
foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly into which the device will be installed.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmful motion such
as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate
enough static electricity to damage an ES devices).
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron with appropriate tip size and shape that will maintain tip
temperature within a 550°F-660°F (288°C-316°C) range.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean.
4. Thoroughly clean the surface to be soldered. Use a small wire-bristle (0.5 inch or 1.25cm) brush with a metal
handle. Do not use freon-propelled spray-on cleaners.
5. Use the following soldering technique:
a. Allow the soldering iron tip to reach normal temperature (550°F to 660°F or 288°C to 316°C)
b. Hold the soldering iron tip and solder strand against the component lead until the solder melts.
c. quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it
there only until the solder flows onto and around both the component lead and the foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
CAUTION: Be sure that no power is applied to the chassis or circuit, and observe all other safety
precautions.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
5
FIGURE 1. USE SOLDERING IRON TO PRY LEADS
IC Removal/Replacement
Some utilized chassis circuit boards have slotted (oblong) holes through which the IC leads are inserted and then
bent flat against the circuit foil. When holes are slotted, the following technique should be used to remove and
replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in
paragraphs 5 on the page under the title of general soldering guidelines.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip
as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with desoldering braid
before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (lt is not necessary to reapply acrylic coating to the
area).
“Small-Signal” Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend the end of each of three leads remaining on the circuit board into a “U” shape.
3. Bend the replacement transistor leads into a “U” shape.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp
the “U” with long nose pliers to insoure metal-to-metal contact, then solder each connection.
6
Power IC, Transistor or Devices Removal/Replacement
1. Heat and remove all solders from the device leads.
2. Remove the heatsink mounting screw (if applicable).
3. Carefully remove the device from the circuit board.
4. Insert new device in circuit board.
5. Solder each device lead, and clip off excess lead.
6. Replace heatsink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicularly to the circuit board.
3. Observing diode polarity, wrap each lead out of the new diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect the solder joints of the two “original” leads on the circuit board copper side. If they are not shiny, reheat
them and apply additional solder if necessary.
TECHNICAL INFORMATION
Picture Tube
Type : 17-inch, Flat Square Tube type
(16.2-inch, viewing area)
Dot Pitch : 0.26mm
Face Treatment : Non-glare / Anti-static
Video
Input Signal : R.G.B Analog
Amp. Bandwidth : 135 MHz
Input Sync : TTL, separate negative / positive
Scan Frequency
Horizontal : 30-86 KHz
Vertical : 50-160 Hz
Max. Resolution
1600 dots X 1200 lines (at 65Hz)
Power Source
Free Voltage (100-240 Vac, 50/60Hz)
Display Area
Standard Display Area : 310mm(H)X232mm(V)
Full Screen Size : 330mm(H)X250mm(V)
Power Consumption
Max. 120W
Dimension
424(W)X440(H)X447.2(D)mm
(set with stand)
Weight (Net/Gross)
18.7 / 21.7 kg
Operating Environment
Temperature : 10~40°C/50~104°F
Relative Humidity : 8~80%
Storage Environment
Temperature : -20~45°C/-4~113°F
Relative Humidity : 5~90%
State Recovery Time Power LED
On None Green
Stand-by 3 seconds Green : 1 second
Suspend Amber : 0.5 second
Off 7 seconds Amber
7
GENERAL INFORMATION
This color monitor automatically scans all horizontal frequencies from 30KHz to 86KHz, and all vertical
frequencies from 50Hz to 160Hz. This color monitor adopted the OSD (On Screen Display), it shows the sync
polarity and frequency and it provides that easily adjust control. This color monitor supports IBM PC, PC/XT,
PC/AT, personal System/2 (PS/2), Apple Macintosh, and compatible users crisp text and vivid color graphics
display when using the following graphics adapters : (VGA, 8514/A, Super VGA, VESA and XGA and Apple
Macintosh Video Card). And so, this color monitor has a maximum horizontal resolution of 1280 dots and a
maximum vertical resolution of 1024 lines for superior clarity of display.
By accepting analog signal inputs which level is zero to 0.7 Volts. This color monitor can display and unlimited
palette of colors depending on the graphics adapter and software being used.
Abbreviations
ADJ Adjustment
AFC Automatic Frequency Control
CRT Cathode Ray Tube
Def Deflection
D.Y Deflection Yoke
FBT Flyback Transformer
H.SYNC Horizontal Synchronization
OSC Oscillator
P.S.U Power Supply Unit
PWA Printed Circuit Board Wiring Assembly
R.G.B Red, Green, Blue
V.Sync Vertical Synchronization
8
PIN CONNECTOR
CAUTIONS FOR ADJUSTMENT AND REPAIR
• Degaussing is always required when adjusting purity or convergence.
• The white balance adjustment has been done by a color analyzer in factory. The adjustment procedure,
described in the service manual is made by a visual check.
• Allow 20 minutes warm-up time for the display before checking or adjusting only electrical specification or
function.
• Reform the leadwire after any repair work.
Caution For Servicing
• In case of servicing or replacing CRT, high voltage sometimes remains in the anode of the CRT. Completely
discharge high voltage before servicing or replacing CRT to prevent a shock to the serviceman.
Arrangement of 15-pin D-sub connector
Pin Signal
1 Red
2 Green
3 Blue
4 GND
5 GND
6 GND - Red
7 GND - Green
8 GND - Blue
9 Reserved
10 GND - H.Sync
11 GND- V.Sync
12 Bi-directional Data (SDA)
13 Horizontal Sync
14 Vertical Sync (VCLK)
15 Data Clock (SCL)
1
610
15
9
OPERATION & ADJUSTMENT
ADJUSTMENT KEY
Launch OSD(On-Screen Display) menus
Select the next function
Increase the value of any selected function
Decrease the value of any selected function
10
ADJUSTMENT PROCESS
MENU
SELECT
MENU MENU
MENU
MENU
SELECT
SELECT
SELECT
MENU
MENU
OSDOFF
CONTRAST 50% BRIGHTNESS
50%
PINCUSHION50% TRAPEZOID 50%
COLOR TEMP.
K
9300 6550 RED GAIN
K
50%
STATUS
H : +31.5KHZ
V : +70.5 HZ
Z
Z
Z
TEST
TEST PATTERN
NO
Z
Z
Z
YES
MENU MENU
R G B R G B
R G B R G B
R G B R G B
R G B R G B
When you choose the icon on the OSD window, you can exit the OSD screen.
11
OSD(On-Screen Display) Menu 1
Adjust the contrast of image, the difference between light and dark
areas on the screen.
Range : 0-100%
Adjust the brightness of the entire display.
Adjust the position of the display horizontally
(left or right).
Adjust the display width (horizontal size).
Adjust the position of the display vertically (up or down).
Adjust the display height (vertical size).
Adjust the display width & height at the same time.
Reset the screen to the Factory Preset Display Settings.
CONTRAST
50
50
BRIGHTNESS
H . POSITION
50
H . SIZE
50
V . POSITION
50
V . SIZE
50
50
IMAGE ZOOM
RECALL
NO YES
12
OSD(On-Screen Display) Menu 2
Adjust the left and right margins for more convex or more concave
margins.
•Image turns to by .
•Image turns to by .
Adjust the trapezoid of the screen by moving the lines inward or outward.
•Image turns to by .
•Image turns to by .
Adjust parallelogram when the screen is leaning left or right.
•Image turns to by .
•Image turns to by .
Adjust the side balance when the sides of the screen are bowed towards
left or right.
•Image turns to by .
•Image turns to by .
Adjust the horizontal picture moire cancellation.
Adjust the vertical picture moire cancellation.
Adjust the focus image.
PINCUSHION
50
50
TRAPEZOID
50
50
PARALLELOGRAM
PIN BALANCE
50
50
ROTATION
H .
MOIRE
50
50
V .
MOIRE
FOCUS
50
Adjust the rotation when the screen is tilted left or right.
•Image turns to by .
•Image turns to by .
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