AMD Hudson D3 Chipset User manual
TECHNICAL M
A
NUAL
Of
AMD Hudson D3 Chipset
Based
for AMD R-Series APU Mini-ITX M/B
NO. G03-NF82-F
Revision: 1.0
Release date: September 4, 2012
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................11
2-2-1 CONNECTORS .............................................................................................11
2-2-2 HEADERS .....................................................................................................13
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................20
3-2 BIOS MENU SCREEN ................................................................................................21
3-3 FUNCTION KEYS .......................................................................................................21
3-4 GETTING HELP ..........................................................................................................22
3-5 MAIN BARS.................................................................................................................22
3-6 MAIN MENU................................................................................................................23
3-7 ADVANCED MENU.....................................................................................................24
3-8 CHIPSET MENU..........................................................................................................30
3-9 BOOT MENU...............................................................................................................32
3-10 SECURITY MENU.......................................................................................................33
3-11 SAVE & EXIT MENU...................................................................................................34
TABLE OF CONTENT
iii
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition 2012-09-04
Item Checklist
5Motherboard
5DVD for motherboard utilities
5User’s Manual
5Cable(s)
5I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
zAMD Hudson D3 Chipset and AMD embedded R-Series APU (FS1R2 processor),
with low power consumption but high performance
zSupport 2 * DDRIII SO-DIMM 800-1866MHz up to 16GB and dual channel function
zIntegrated with dual Realtek RT8111EVL Gigabit LAN chips
zIntegrated ALC662 6-channel HD Audio Codec
zSupport USB 2.0/ USB 3.0 data transport demands
zSupport PCI Express x16 slot and Mini-PCIE slot
zOnboard 6* SATAIII ports
zHDMI, DP and VGA multi video output options
zIntegrated LPC SIO F71869A
zSupport TPM 1.2
zSupport 6* COM ports
zSupport CPU/SYSTEM Smart FAN
zSupports ACPI S3 Function
zCompliance with EuP Standard
zSupport Watchdog Timer Technology
2
1-2 Specification
Spec Description
Design zMini-ITX form factor 6 layers ; PCB size: 17.0x17.0cm
Chipset zAMD A75 FCH Hudson D3 Chipset
CPU Socket zAMD FS1r2 Socket ,Support AMD R-Series processor
* for detailed CPU support information please visit our website
Memory Slot
zDDRIII SO-DIMM slot x2
zSupport DDRIII 800/1066/1333/1600/1866 MHz DDRIII
SO-DIMM expandable to 16GB
zSupport dual channel function
Expansion Slot z1 pcs of PCI Express x16 slot
z1 pcs of Mini-PCIE slot
Dual LAN Chip
zIntegrated with dual Realtek RTL8111EVL PCI-E Gigabit
LAN chips that support Fast Ethernet LAN function of
providing 10/100/1000Mbps Ethernet data transfer rate
Audio Chip zIntegrated with Realtek ALC662 6-channel Audio Codec
zAudio driver and utility included
BIOS z32M DIP Flash ROM
Multi I/O
zHDMI port connector x1
zVGA port connector x1
zDisplay port connector x 1
zCOM port connector x 2
zRear panel USB 3.0 port connector x2
zRear panel USB 2.0 port connector x4
zRJ-45 LAN connector x2
zAudio connector x3 (Line-in/SPDFI-out; Line-out; MIC)
zSATAIII Connector x6
zFront panel audio header x1
zHDMI_SPDIF header x1
zUSB 2.0 header x2 (support four expansion USB 2.0 ports)
zUSB 3.0 header x1 (support two expansion USB 3.0 ports)
3
zSerial port header x4
zTX-RXCOM6 header x1
zKBMS header x1
zTPM 1.2 header x1
zGPIO header x1
zCIR header x1
zLANLED header x2
zSpeaker header x1
zPWRLED header x1
zFront panel header x1
1-3 Layout Diagram
Rear IO Diagram
MIC-IN
Display Port
Line-IN//SPDIF-OUT
Line-OUT
USB 3.0 Ports
HDMI Port
RJ-45 LAN Ports
VGA Port
USB 2.0 Ports
Serial Port
Serial Port
4
Motherboard Internal Diagram
USB 2.0 Heade
r
s
USB 3.0 Ports
over HDMI Port
ATX Powe
r
connecto
r
ATX 12V
Power Connecto
r
DDRIII SODIMM Slo
t
x 2
（DDRIII 800-1866 MHz）
Speaker Header
VGA Port
over
Display Port
Audio Connecto
r
s
HDMI_SPDIF
Heade
r
*PCI Express x16 by 16 Lane Slot (PE1)
CPUFAN Header
RJ-45 Port over
USB 2.0 Ports
PWRLED Header
Front Panel Audio Heade
r
Front Panel Heade
r
CIR Heade
r
SATAIII Ports
(
SATA1
/
2/3/4/5/6
)
TX-RXCOM6
Heade
r
RJ-45 Port over
USB 2.0 Ports
Se
r
ial Ports
KBMS Heade
r
M
in
i
-PCIE Slot
USB 3.0 Heade
r
LANLED Heade
r
s
TPM Heade
r
FS1R2 APU
Socket
S
YSFAN2 Header
S
YSFAN1 Header
AMD Hudson D3 Chi
p
se
t
GPIO Heade
r
Serial Port Headers
5
Motherboard Jumper Position
Audio Chip
JBAT1
LAN Chi
p
CASE_OPEN1
JP3
LAN Chi
p
JP8
JP4
JP9
LPC_SIO
Chip
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